Ironwood Electronics' SG-BGA-6000 family of gigahertz-rate BGA sockets offers zero-insertion-force (ZIF) performance for preproduction systems without sacrificing board real estate or device ...

BGA socket adapter provide an inexpensive and reliable interconnect for attaching BGA chips to target board. These adapters have less than half of the insertion force of competitive adapters, shorter ...

Comprising a small pc-board with decoupling capacitors on one side and solder balls on the other, the QStack power delivery module attaches directly underneath a BGA package to reduce or eliminate the ...

TDA Systems Inc. of Portland, Ore., is developing a time domain reflectometry (TDR) software prototype for detecting defects in ball-grid-array (BGA) IC packages. TDR measurement is recognized as an ...