Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Simple and inexpensive semiconductor devices in earlier generations of electronic systems were easily discarded or recycled when they were damaged either before or during the printed circuit board ...

PulseForge’s flux-less approach overcomes these limitations by leveraging the unique physics of Photonic Soldering, where rapid heating significantly limits oxygen penetration during reflow. The ...

The unparalleled pin density and low lead inductance of ball grid arrays (BGA) are essential in today’s high pin count, high frequency integrated circuits. However, that same pin density and unique ...