The mainstream adoption of 3D-IC has become a question mark due to critical challenges ranging from early-stage chip designs to 3D assembly exploration to final design signoff. A new EDA tool claims ...

Generative AI is making its way into edge devices: though there remain bottlenecks to overcome in terms of software and hardware, the overall trend is very significant. PC and mobile brands, chip ...

A new software combines connectivity, scalability and data-driven artificial intelligence (AI) capabilities to push the boundaries of the IC verification process and make chip design teams more ...

China IC design firm Rockchip is facing an open-source licensing dispute after GitHub reportedly froze code repositories linked to its projects, drawing attention across the semiconductor and software ...

Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution. The solution provides a fast, predictable pathfinding, planning and ...