Oliver Campbell, Dell Technologies’ Director of Procurement & Packaging Engineering, has been with the tech innovation vanguard for more than half the company’s 39-year existence. At that time, the ...

Although consumers care about the products they buy, the packaging matters, too. It is a similar concern for company leaders. An insufficient package could result in goods arriving spoiled, broken or ...

Undergraduate students from packaging science, graphic design and industrial design at Rochester Institute of Technology worked over the semester to improve packaging and branding identity for ...

Medical packaging sits at the intersection of materials science, sterilization, human factors, and global regulatory ...

Packaging science goes far beyond mere protection and containment. It's a bridge between products and consumers, serving as a powerful tool for marketing, sustainability, and innovation. This is where ...

Genesis learns art and engineering are a “package deal” with Packaging Engineer Camille Corr Chism! Genesis joins professor Camille Corr Chism at Michigan State University’s School of Packaging, where ...

RIT’s print and graphic media technology curriculum is being integrated into the university’s packaging science program.

TERRE HAUTE, Ind. (Inside INdiana Business) — Indiana State University is one of the few higher education institutions in the United States working to fill the talent gap in a relatively unknown, but ...

This concentration is designed to equip practitioners with the tools necessary to meet tomorrow’s challenges concerning packaging and its sustainability in the associated supply chains. To this end, ...

This system is capable of packaging chips with a high accuracy of ±0.8μm using thermal compression bonding “TCB” on 515mm × 510mm and 600mm × 600mm panels complying with the SEMI Standards. It can ...

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced ...

Number of options for adding more features into chips grows beyond just 2.5D and 3D as mainstream packaging technologies run out of steam. Apple, Samsung and others are developing the next wave of ...