TAIPEI (Taiwan News) — Grand Process Technology has signed a cooperation agreement with National Taiwan University of Science ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
LG Innotek said on the 10th that it has developed a "next-generation smart integrated circuit (IC) substrate" that boosts performance while cutting carbon emissions to half of previous levels. It is ...
Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...
Johnstech International has announced the release of its new Low-Force XL contacts for Pad ROL100A Series and Pad ROL200 Series test contactors for testing NiPdAu IC packages. The new contactors offer ...
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