Process-control environments are under constant threat from cyberattacks, internal threats, and even simple vandalism.

Since about 2015, when Don Bartusiak, the then chief engineer at ExxonMobil Research & Engineering, publicly advocated for the development of a new, standards-based, open—yet secure—process control ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Honeywell and Danfoss are partnering to integrate variable frequency drive (VFD) technology with Honeywell's Experion Process Knowledge System platform to streamline motor control, reduce energy ...