This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...

In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a ...

The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as Flip Chip technology. In most cases, ...

Teasing out key trends and themes with Mark O’Shea, senior business development manager for Nordson EFD. Booth demonstrations highlighted automation, connectivity and process ...