Business Wire

Global Fan-out Wafer Level Packaging (FOWLP) Market 2019-2023 | 16% CAGR Projection Through 2023 | Technavio

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Wolfspeed Unveils Foundation for Next‑Generation AI Data Center Advanced Packaging Leveraging 300mm Silicon Carbide Technology

Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced that its 300mm silicon carbide (SiC) technology platform could serve as a foundational materials enabler ...
Optics

Redefining Wafer-Level Packaging Production with Heidelberg Instruments Flexible Direct Writing Technology

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...
Digi Times

Samsung steps up fan-out wafer-level packaging deployment

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers

Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets- FREMONT, Calif., ...
Digi Times

ACE’s wafer-level packaging to enter volume production in fourth quarter

Advanced Chip Engineering (ACE), engaged in development of wafer-level packaging technology, noted that its 6-inch products will enter mass production this October. Since last November, it has broken ...
Fudzilla

TSMC gets fan-out (InFO) wafer-level packaging

TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016. Apparently the fruity cargo cult Apple has already signed ...
TweakTown

Apple iPhone 18 with A20 chip could switch to wafer-level multi-chip module packaging

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
Electronic Design

STMicroelectronics, STATS ChipPAC, And Infineon Join Forces On Wafer-Level-Packaging

Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) ...
Business Wire

SkyWater Florida and Deca Technologies Announce $120M DOD Award to Expand Advanced Packaging Capabilities in Osceola County, Florida

KISSIMMEE, Fla.--(BUSINESS WIRE)--SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, and Deca Technologies (Deca), a leading provider of advanced electronic interconnect ...
Seeking Alpha

NVE outlines accelerated growth plans with in-house wafer-level chip scale packaging and 4% sequential revenue increase

CEO Daniel Baker reported a 4% sequential increase in revenue for the quarter, highlighting strong increases in distributor and nondefense sales, despite an expected decrease in defense sales. Baker ...