Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

A new technical paper, “Exploring Silent Data Corruption as a Reliability Challenge in LLM Training,” was published by ...

As DRAM technologies scale to increasingly tighter pitches, the patterning requirements exceed the limits of conventional ...

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.

Advances in GPU computing and multi-beam mask writing are removing constraints to enable entirely curvilinear masks.

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...