Amorphous oxide semiconductors like IGZO (indium gallium zinc oxide) offer acceptable carrier mobility with very low leakage.

While NVIDIA includes its CPU and RAM in its super-speed GPU fabric, AMD may have done something else altogether with its ...

Detailed Platform Analysis in RightMark Memory Analyzer. Part 12: VIA C7/C7-M Processors 4838 文章 ...

This brute-force scaling approach is slowly fading and giving way to innovations in inference engines rooted in core computer ...

Every time we open ChatGPT, Claude, or Gemini, we start from zero. Each conversation, each prompt, each insight erased the ...

That price puts the new chip $20 above the original launch price of the Ryzen 7 9800X3D and roughly $30 higher than many current listings, leaving ...

The 9850X3D is AMD's follow-up to the Ryzen 7 9800X3D, which has been well-loved by gamers since its launch in November 2024. The CPU has an unusual cache layout that stacks the L3 memory below the ...

Semiconductor Engineering tracked 12 rounds of $100 million or more in Q4 and 11 in Q3, a significant increase from earlier ...

With firms looking increasingly unable to buy more memory chips, squeezing every last drop of performance from existing ...

HBF memory stacks could improve GPU performance and AI workloads, offering ten times HBM capacity in real systems ...

Detailed in a recently published technical paper, the Chinese startup’s Engram concept offloads static knowledge (simple ...

DeepSeek's new Engram AI model separates recall from reasoning with hash-based memory in RAM, easing GPU pressure so teams ...