COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...
COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...
The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA CUDA’s direct sparse solver, the Granular Flow Module, and time-explicit structural dynamic ...
Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...
It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...
COMSOL Multiphysics is a comprehensive simulation software platform that enables engineers and scientists to model and analyze multidisciplinary physical systems. By integrating multiple fields of ...
Department of Electrical and Computer Engineering, The University of the West Indies, St. Augustine Campus, St. Augustine, Trinidad and Tobago Introduction: Human body communication (HBC) utilizes the ...
Contractors can predict the potential outcome of a concrete casting process by using the maturity method, but it can be difficult to apply this technique in the field. This is why Heidelberg Materials ...
The latest version of the multiphysics simulation software introduces the Electric Discharge Module, GPU-accelerated simulations and updates for greater modelling productivity. Image 1: Pressure ...
Pressure acoustics in an office environment, modeled in COMSOL Multiphysics version 6.3 using GPU support for faster results. Image courtesy of COMSOL. COMSOL has officially released COMSOL ...
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...