Formula 1 used to be shaped almost entirely on real asphalt, with drivers pounding around private test tracks until the ...

Engineers can now optimize FDM parts for real applications with reduced trial-and-error testing, allowing manufacturers to ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...

There’s always a strange joy in watching virtual money go up. Business simulation games have a special kind of magic. What ...